Dam & Fill
Electronic Chemicals
Polysciences’ dam & fill encapsulants are engineered formulations used in electronic packaging where a high-viscosity “dam” is dispensed to define boundaries then a low-viscosity “fill” flows within to encapsulate components. These products deliver strong adhesion, excellent thermal performance, controlled flow, and stability to protect PCBs and bonded devices under harsh conditions.
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Collections
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Bioprocessing, Lipids & Transfection
Find transfection reagents and lipids with various preparations and regulatory tiers to...
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Electronic Chemicals
Access our portfolio of electronic chemicals, including underfills, encapsulants, and conformal coatings,...
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Histology, Cytology & Pathology
Explore a comprehensive range of products for histology, cytology, and pathology, including...
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Instrument Standards
Find instrument standards for analytical instruments like cell analyzers and flow cytometers,...
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Histology & Microscopy
Equip your lab with our histology and microscopy products, offering high-quality staining...
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Life Sciences
Discover specialty chemicals and reagents supporting research in histology, microscopy, and anatomic...
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Microscopy & Electron Microscopy
Delve into our microscopy collections, featuring electron microscopy reagents and accessories essential...
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Microspheres & Particles
Popular Searches: Polystyrene Microspheres | Silica Microspheres | Carboxyl Microspheres Browse our selection of microspheres...
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Specialty Chemicals & Adjuncts
Access our range of specialty chemicals and adjuncts, including resins, catalysts, solvents,...
