Electronic Chemicals

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Encapsulants

Polysciences’ Encapsulants are part of the Electronic Chemicals portfolio—products designed for dam & fill, glob top, wire bond, and optical encapsulation. Formulations include epoxy and silicone-based encapsulants with features like high modulus, low cure stress, high adhesion to organic & inorganic substrates, excellent thermal performance, and 100% solids options.

Abstract image of an electronic component covered by a smooth, glossy encapsulant dome, with glowing edges against a dark PCB background