Electronic Chemicals

← Back to all Electronic Chemicals products

Glob Top

Polysciences provides Glob Top encapsulants, rigid or semi-rigid epoxies used in chip-on-board and wire bond applications to encapsulate and protect components from moisture, mechanical stress, and high temps. The Glob Top line includes low-viscosity, high thermal resistance epoxy formulations.

Abstract image of an electronic component covered by a smooth, glossy encapsulant dome, with glowing edges against a dark PCB background