⟡ DMP-30 / Epoxy Curing Catalyst / Amine Accelerators
2,4,6-Tris-(dimethylaminomethyl)phenol, commonly known as DMP-30 or Tris-DMP, is a Lewis base catalyst used to accelerate room-temperature curing of epoxy resin systems. It functions as both a curing accelerator and co-curing agent in epoxy formulations requiring faster cure response and improved processing control.
DMP-30 is widely used in epoxy embedding media, sealants, concrete adhesives, coatings, casting systems, and industrial resin formulations. Its tertiary amine functionality promotes epoxy cure reactions and helps activate other curing agents in thermoset polymer systems.
This ≥96% grade is suitable for laboratory and industrial applications where consistent catalytic performance, resin compatibility, and reliable epoxy cure acceleration are required.
Key Features & Benefits
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Epoxy curing catalyst: accelerates cure reactions in epoxy resin systems
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≥96% purity: suitable for research, formulation, and industrial use
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Lewis base catalyst: activates epoxy curing chemistry and co-curing reactions
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Room-temperature cure support: useful in systems requiring ambient cure acceleration
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Embedding media accelerator: used in epoxy embedding media kits and resin workflows
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Industrial formulation additive: supports sealants, concrete adhesives, coatings, and casting resins
Product Specifications
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Product name: 2,4,6-Tris-(dimethylaminomethyl)phenol
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Common names: DMP-30, Tris-DMP
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Product number: 00553
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CAS number: 90-72-2
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Purity: ≥96%
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Functionality: Epoxy curing catalyst, accelerator, co-curing agent, Lewis base catalyst
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Typical use: Epoxy resin systems, embedding media, sealants, concrete adhesives, coatings, and industrial formulations
Typical Applications
Epoxy Resin Curing
DMP-30 is used as an accelerator and catalyst for epoxy resin systems where faster cure response, improved handling, and controlled room-temperature curing are desired.
Embedding Media
Commonly used as an accelerator in epoxy embedding media kits for microscopy, histology, and materials preparation workflows.
Sealants & Concrete Adhesives
Functions as a catalyst and co-curing agent in sealant and concrete adhesive formulations requiring strong cure development and formulation reliability.
Coatings & Casting Systems
Supports epoxy coatings, casting compounds, and thermoset resin systems where cure speed and network formation are important to final performance.
Why Researchers & Manufacturers Use DMP-30
DMP-30 is selected for epoxy formulation work because it provides strong catalytic activity, compatibility with epoxy resin systems, and reliable acceleration of room-temperature cure reactions.
It is especially useful in applications requiring controlled cure behavior, epoxy embedding media preparation, adhesive formulation, sealant development, and thermoset resin processing.
Handling & Storage
- Store in a cool, dry place at room temperature.
- Keep container tightly closed when not in use.
- Use appropriate personal protective equipment during handling.
- Avoid moisture exposure and incompatible materials.
- Consult the SDS for complete safety and handling information.
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FAQ
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What is DMP-30 used for?
DMP-30 is used as a curing catalyst and accelerator for epoxy resin systems, including embedding media, sealants, concrete adhesives, coatings, and casting formulations.
What is the CAS number for DMP-30?
The CAS number for 2,4,6-Tris-(dimethylaminomethyl)phenol, commonly known as DMP-30, is 90-72-2.
Is DMP-30 a curing agent or accelerator?
DMP-30 can function as both an epoxy curing accelerator and co-curing agent. It is commonly used to activate and accelerate cure reactions in epoxy resin systems.
Can DMP-30 be used for room-temperature epoxy curing?
Yes. DMP-30 is commonly used to support room-temperature curing of epoxides and improve cure speed in ambient-cure epoxy formulations.
What are common synonyms for DMP-30?
Common synonyms include 2,4,6-Tris-(dimethylaminomethyl)phenol, DMP-30, and Tris-DMP.
Do you supply DMP-30 for research and industrial applications?
Yes. Polysciences supplies DMP-30 for laboratory, epoxy formulation, embedding media, adhesive, coating, sealant, and industrial resin applications.
