SD54G0 EdgeCONTROL™

Product Description

SD54G0 EdgeCONTROL™ is a low modulus retention dam specifically formulated to offer low cure stress and low warpage for liquid encapsulation of BGA and MCM packages. It provides good adhesion to various rigid and flexible organic and ceramic substrates and features high viscosity and high thixotropy. SD54G0 is thermally curable and is designed to be used with LoSTRESS™ liquid encapsulant.

Key Features

• Low modulus retention dam
• Low cure stress
• Low warpage
• Good adhesion to rigid and flexible organic and ceramic substrates
• High viscosity
• High thixotropy
• Thermally curable
• Designed to be used with LoSTRESS™ liquid encapsulant

Typical Uses

• Liquid encapsulation of BGA packages
• Liquid encapsulation of MCM packages
• Damming applications used with LoSTRESS™ liquid encapsulant

FAQs

1. What is SD54G0 EdgeCONTROL™?
   SD54G0 is a low modulus retention dam formulated to offer low cure stress and low warpage for liquid encapsulation of BGA and MCM packages.
2. What package types is SD54G0 intended for?
   SD54G0 is intended for liquid encapsulation of BGA and MCM packages.
3. What substrates does SD54G0 adhere to?
   It has good adhesion to various rigid and flexible organic and ceramic substrates.
4. What are the rheological characteristics of SD54G0?
   SD54G0 is described as high viscosity and high thixotropy.
5. How is SD54G0 cured?
   SD54G0 is thermally curable.
6. Is SD54G0 designed to be used with another encapsulant?
   Yes. SD54G0 is designed to be used with LoSTRESS™ liquid encapsulant.