SD1011 EdgeCONTROL™

Product Description

SD1011 EdgeCONTROL™ is a 100% solids liquid encapsulant engineered for encapsulation and bonding applications that demand very high modulus and exceptional heat resistance. This thixotropic material is especially well suited for use as a damming compound in conjunction with low-viscosity encapsulants, helping maintain edge definition and dimensional stability during processing. SD1011 delivers a rigid, durable, low-stress encapsulation with high Tg performance and thermal cure capability.

Shipping note: Ships on dry ice (+$45.00 to S&H).

Key Benefits

• 100% solids formulation for consistent, void-minimized encapsulation
• Very high modulus for rigid structural support and edge control
• Excellent heat resistance with high Tg performance
• Thixotropic behavior ideal for damming applications
• Dimensional stability to help maintain encapsulant geometry
• Thermally curable for reliable, production-ready processing

Typical Applications

• Damming: Used as an edge control or dam material with low-viscosity encapsulants
• Encapsulation: High-modulus protection for electronic and semiconductor assemblies
• Bonding: Applications requiring rigid adhesion and thermal durability
• Hybrid Systems: Paired with fill or glob top materials in multi-step encapsulation processes

Why Choose SD1011 EdgeCONTROL™

• Edge definition: Thixotropic profile helps prevent flow and maintain boundaries.
• Thermal reliability: Designed for high-temperature operating environments.
• Mechanical integrity: Rigid, durable cure supports long-term dimensional stability.

Processing & Handling Notes

• Dispense using equipment suitable for thixotropic, high-modulus encapsulants.
• Use as a dam in combination with low-viscosity fill or glob top materials where defined edges are required.
• Thermally cure according to a validated profile appropriate for your assembly and substrates.
• Confirm compatibility, cure, and performance in your specific process environment.
• Shipping: Ships on dry ice (+$45.00 to S&H).

FAQs

1. What is SD1011 EdgeCONTROL™ used for?
   SD1011 is used as a high-modulus encapsulant and as a damming material to control flow when used with low-viscosity encapsulants.
2. Why is thixotropy important for damming applications?
   Thixotropic materials resist flow under static conditions, helping maintain defined edges while still allowing controlled dispensing during application.
3. What performance does SD1011 provide after cure?
   After cure, SD1011 forms a rigid, durable encapsulation with high Tg, dimensional stability, and heat resistance.
4. Is SD1011 suitable for high-temperature environments?
   Yes. SD1011 is designed for applications requiring high heat resistance and thermal stability.
5. Can SD1011 be combined with other encapsulants?
   Yes. It is commonly used as a dam material in multi-step encapsulation systems with low-viscosity fill or glob top encapsulants.
6. Are there special shipping requirements?
   Yes. SD1011 ships on dry ice (+$45.00 to S&H).