EW8002 NoSWEEP™ Wire Bond Encapsulant

Product Description

EW8002 NoSWEEP™ Wire Bond Encapsulant is a 100% solids, silica-filled liquid encapsulant engineered for fast, reliable protection of semiconductor wire bonds. Designed for quick self-leveling in large dam & fill or glob top processes, EW8002 also excels at encapsulating narrow-diameter, long, and ultra-fine pitch wire bonds. Its low modulus and low CTE help reduce stress on delicate assemblies, while strong adhesion to both inorganic and organic substrates supports robust device integrity. EW8002 is thermally curable and non-sweeping to help maintain wire bond placement during encapsulation. Available in dam & fill and glob top versions.

Key Benefits

• 100% solids, silica-filled for stable coverage and reliable protection
• Quick self-leveling for efficient large dam & fill or glob top processing
• Non-sweeping behavior to help preserve wire bond position during encapsulation
• Low modulus and low CTE to minimize stress on sensitive semiconductor assemblies
• Excellent adhesion to inorganic and organic substrates
• Thermally curable for consistent, production-friendly processing

Typical Applications

• Wire bond encapsulation for semiconductor and microelectronic devices
• Dam & fill encapsulation for larger cavities and filled regions
• Glob top encapsulation for localized protection of wire-bonded areas
• Encapsulation of narrow-diameter, long, and ultra-fine pitch wire bonds

Performance Highlights

• Flow: Designed for fast self-leveling to support uniform coverage
• Mechanical: Low modulus to help reduce stress on components
• Thermal: Low CTE to improve reliability through thermal cycling
• Adhesion: Strong bonding to mixed substrate types (inorganic/organic)
• Process: Thermal cure capability with non-sweeping behavior

FAQs

1. What is NoSWEEP™ designed to do?
   EW8002 NoSWEEP™ is formulated to help prevent wire movement (wire “sweep”) during encapsulation, supporting consistent wire bond geometry and device reliability.
2. Which encapsulation methods is EW8002 best suited for?
   It is optimized for large dam & fill and glob top applications, and it is also suitable for encapsulating narrow-diameter, long, and ultra-fine pitch wire bonds.
3. Why do low modulus and low CTE matter for semiconductor encapsulation?
   Low modulus can reduce mechanical stress on delicate assemblies, while low CTE helps minimize stress from thermal expansion mismatch during thermal cycling.
4. Does EW8002 adhere well to common package materials?
   Yes. EW8002 is designed for excellent adhesion to both inorganic and organic substrates to support long-term protection and integrity.
5. How is EW8002 cured?
   EW8002 is thermally curable. Use your established thermal cure profile and process controls appropriate for your device, materials, and throughput requirements.
6. Is EW8002 available in different formats?
   Yes. EW8002 is available in dam & fill or glob top versions to match your application needs.

Handling & Use Notes

• Mix and dispense using equipment and practices appropriate for silica-filled, 100% solids encapsulants.
• Validate flow, coverage, and cure conditions on your specific substrates and wire bond geometries.
• Store and handle according to internal quality requirements and standard chemical handling practices.