EW8002 NoSWEEP™ Wire Bond Encapsulant

100% solid, silica filled liquid encapsulant designed for quick self-leveling in large dam & fill or glob top applications, & encapsulation of narrow diameter, long, & ultra fine pitch wire bonds on semiconductor devices. Low modulus & CTE, excellent adhesion to inorganic & organic substrates, thermally curable, & non-sweeping. Available in dam & fill or glob top versions.