PC8007 Low Viscosity Glob Top Encapsulant

Product Description

PC8007 Low Viscosity Glob Top Encapsulant is a high-performance epoxy designed for encapsulation, bonding, and sealing applications that require high modulus and strong temperature resistance. Its low-viscosity profile supports efficient dispensing and coverage, while the cured material delivers a rigid, high-strength, durable encapsulation layer suited for demanding electronic assemblies.

Shipping note: Ships on dry ice (+$45.00 to S&H).

Key Benefits

• High thermal resistance for performance in elevated-temperature environments
• Rigid, high-strength epoxy designed for high-modulus requirements
• Durable protection for long-term encapsulation and sealing
• Low viscosity to support dispensing, flow, and coverage in glob top applications
• Encapsulation-ready for electronic bonding and sealing use cases

Typical Applications

• Glob Top Encapsulation: Protective coverage over chips, wire bonds, and sensitive components
• Bonding & Sealing: Assemblies requiring rigid adhesion and environmental protection
• Encapsulation: Electronics and components needing high modulus and temperature resistance

Why Choose PC8007

• Designed for demanding conditions: High thermal resistance supports performance stability.
• Structural protection: Rigid, high-strength cure helps maintain encapsulant integrity.
• Process efficiency: Low viscosity can improve dispensing and help reduce voiding with validated processing.

Processing & Handling Notes

• Use standard epoxy handling practices and appropriate PPE.
• Dispense using equipment suited for low-viscosity epoxies and your target dot/coverage geometry.
• Thermal cure per your validated profile and assembly requirements.
• Confirm compatibility and performance on your substrates and components prior to scale-up.
• Shipping: Ships on dry ice (+$45.00 to S&H).

FAQs

1. What is PC8007 used for?
   PC8007 is a high-performance epoxy encapsulant for glob top encapsulation and other bonding/sealing applications requiring high modulus, strength, and temperature resistance.
2. Why is low viscosity important for glob top encapsulation?
   Low viscosity can support smoother dispensing and improved flow/coverage around features prior to cure, helping achieve consistent encapsulation when processed under validated conditions.
3. What performance characteristics does PC8007 provide after cure?
   The cured epoxy is rigid, high strength, and durable, making it suitable for assemblies that benefit from a high-modulus encapsulation layer.
4. Is PC8007 suitable for elevated temperature environments?
   PC8007 is designed with high thermal resistance to support performance in higher-temperature applications.
5. Can PC8007 be used for bonding and sealing?
   Yes. In addition to encapsulation, it is suited for bonding and sealing uses where rigidity and temperature resistance are important.
6. Are there special shipping requirements?
   Yes. PC8007 ships on dry ice (+$45.00 to S&H).