Phenolic Beads, Hollow

Phenolic Beads, Hollow - Polysciences
Phenolic Beads, Hollow - Polysciences
Product Number:
17806

Size

Price

$311.00

Quantity

Bulk Request

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Product Specifications

    Refer to Related Documents

Appearance
    Red brown powder, ordorless
Application
    General use
Glass Transition Temperature (Tg)
    200 - 220° C
Soluble In
    Insoluble in water
Particle Composition
    phenolic
Diameter Nom
    5 - 127µm
Conductivity
    100% solids (dry)
Concentration Nom
    100% solids (dry)
Chloride Ions
    Red brown powder, ordorless
Safety Data Sheet (SDS)
Related Documents
References

    No References

Product Description

In many uses of liquid resins, it is desirable to reduce the weight of the finished product. One way to reduce the weight below the original resin weight is to incorporate a suitable additive. Hollow phenolic microspheres are excellent for use in a variety of industrial applications. They are lightweight, chemically inert, and mechanically strong. They can be excellent adhesives, gap filling formulations, sandable putties, syntactic foams, and molded and laminated structures that must be lightweight and strong. About 30% by weight will make most resins unpourable. Filling casting are quite machinable; turns casting brown.
Nominal Reference Values
Composition: Phenolic resin (Phenol formaldehyde resin)
Size Range: 5 - 127µm
Bulk Density: 0.104 g/cm3, max; 6.5 lb/ft3, max
Relative Density: 0.20 - 0.80 g/cm3
Average Hydrostatic Compressive Strength: 350psi

Phenolic Beads, Hollow - Polysciences
Phenolic Beads, Hollow - Polysciences
Product Specifications

    Refer to Related Documents

Appearance
    Red brown powder, ordorless
Application
    General use
Glass Transition Temperature (Tg)
    200 - 220° C
Soluble In
    Insoluble in water
Particle Composition
    phenolic
Diameter Nom
    5 - 127µm
Conductivity
    100% solids (dry)
Concentration Nom
    100% solids (dry)
Chloride Ions
    Red brown powder, ordorless
Safety Data Sheet (SDS)
Related Documents
References

    No References