Poly(ethylene glycol)-bisphenol A diglycidyl ether adduct

Poly(ethylene glycol)-bisphenol A diglycidyl ether adduct
Poly(ethylene glycol)-bisphenol A diglycidyl ether adduct
Product Number:
04686
CAS #
37225-26-6

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Product Specifications
Linear Formula
    (CH3)2C[C6H4-H-[OCH2CH(OH)CH2(OCH2CH2)nOH]]2
Appearance
    hard solid
Molecular Weight
    18500
Safety Data Sheet (SDS)
Handling
    Glove, chemical goggles & fume hood
Storage
    Store at room temperature
Hazards
    Irritant
Hazard Code
    H6g
Related Documents
References

    No References

Product Description

Poly(ethylene glycol)-bisphenol A diglycidyl ether adduct is a PEG-modified bisphenol A diglycidyl ether polymer supplied for resin, coating, adhesive, and materials formulation research. The material combines a polyethylene glycol segment with bisphenol A diglycidyl ether functionality, making it useful in epoxy-based and crosslinkable polymer systems.

Synonyms: PEG-bisphenol A diglycidyl ether adduct; polyethylene glycol bisphenol A diglycidyl ether adduct; PEG-modified epoxy adduct.

This polymeric adduct is supplied as a hard solid with a molecular weight of 18,500. It may be used in research and development workflows where hydrophilic PEG character and epoxy-reactive resin chemistry are being evaluated in coatings, adhesives, sealants, and specialty polymer formulations.

Researchers and formulators commonly evaluate PEG-modified epoxy adducts for adjusting flexibility, polarity, surface properties, and network behavior in crosslinked or curable polymer systems.

Key Properties

  • PEG-modified bisphenol A diglycidyl ether adduct
  • CAS #: 37225-26-6
  • Molecular weight: 18,500
  • Appearance: hard solid
  • Linear formula: (CH3)2C[C6H4-H-[OCH2CH(OH)CH2(OCH2CH2)nOH]]2
  • Useful in resin, coating, adhesive, and sealant formulation research

Applications

Epoxy Resin Formulation

This adduct may be used in epoxy resin and polymer formulation studies where PEG-modified bisphenol A diglycidyl ether chemistry is desired.

Coatings Research

The material can be evaluated in specialty coating systems where flexibility, polarity, surface behavior, or resin compatibility are important formulation variables.

Adhesives & Sealants

PEG-modified epoxy adducts may be used in adhesive and sealant development to study bonding performance, flexibility, and cured network properties.

Crosslinkable Polymer Systems

This product is suitable for research involving crosslinkable polymer matrices, epoxy-reactive systems, and specialty thermoset formulation development.

Surface Modification Studies

The PEG-containing structure may be useful in surface modification research where hydrophilic polymer character is being incorporated into resin or coating systems.

Formulation & Compatibility Considerations

  • Designed for use in polymer, resin, coating, adhesive, and sealant research
  • May be evaluated in epoxy-based or crosslinkable systems
  • Performance depends on formulation chemistry, curing conditions, additives, and substrate compatibility
  • Bench-scale compatibility testing is recommended before scale-up

Final material properties depend on resin system, stoichiometry, catalyst or curing agent selection, processing conditions, and end-use requirements.

Preparation Tips

  • Confirm compatibility with the selected resin, solvent, additive package, and curing system
  • Use controlled mixing conditions to support uniform incorporation into formulations
  • Evaluate cure response and final properties at small scale before production use
  • Adjust formulation parameters based on viscosity, handling behavior, and target performance

Handling & Storage

  • Store at room temperature
  • Use gloves, chemical goggles, and a fume hood
  • Handle as an irritant
  • Keep container tightly closed when not in use
  • Follow standard laboratory chemical handling procedures

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FAQ

Click a question to expand.

1. What is Poly(ethylene glycol)-bisphenol A diglycidyl ether adduct used for?

It is used in research and formulation work involving epoxy resins, coatings, adhesives, sealants, crosslinkable polymer systems, and specialty material development.

2. What is the molecular weight of this product?

The listed molecular weight is 18,500.

3. What is the appearance of this product?

This product is supplied as a hard solid.

4. Can this product be used in epoxy resin systems?

Yes. It may be evaluated in epoxy-based and crosslinkable polymer systems, depending on formulation chemistry and processing conditions.

5. How should this product be handled and stored?

Store at room temperature. Use gloves, chemical goggles, and a fume hood when handling the material.

Safety & Documentation

This product is listed as an irritant. Use appropriate personal protective equipment and standard laboratory chemical handling procedures. Refer to the product Safety Data Sheet (SDS) and product specifications for complete handling, storage, and safety guidance.

Poly(ethylene glycol)-bisphenol A diglycidyl ether adduct
Poly(ethylene glycol)-bisphenol A diglycidyl ether adduct
Product Specifications
Linear Formula
    (CH3)2C[C6H4-H-[OCH2CH(OH)CH2(OCH2CH2)nOH]]2
Appearance
    hard solid
Molecular Weight
    18500
Safety Data Sheet (SDS)
Handling
    Glove, chemical goggles & fume hood
Storage
    Store at room temperature
Hazards
    Irritant
Hazard Code
    H6g
Related Documents
References

    No References